Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1993-03-04
1994-05-17
Jackson, Jerome
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257706, 257718, 257719, 257727, H01L 2302, H01L 2342, H01L 2344, H01L 2340
Patent
active
053130995
ABSTRACT:
A heat sink assembly adapted for use with an electronic device package such as a microprocessor having a grid array is shown having, in a first embodiment, a threaded base of a finned heat sink adapted to be received in a threaded bore of an adaptor which mounts onto the electronic device package. Desired thermal coupling is achieved by screwing down the heat sink in biasing engagement with the package. An alternate embodiment shows the heat sink which has a snap on flange to attach the heat sink to the adaptor.
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Rife William B.
Tata Peter D.
Arroyo T. M.
Jackson Jerome
Square Head, Inc.
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