Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1998-09-28
1999-08-31
Williams, Alexander Oscar
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257718, 257726, 257731, 257727, 257706, H01L 2340, H01L 2328, H01L 2342
Patent
active
059457368
ABSTRACT:
A heat dissipating device which can provide multiple levels of pressure to a semiconductor package, having an outer peripheral ceramic region and an inner silicon region, is provided. A top cover member is provided with a central female-threaded bore. The top member is secured, without the use of tools, to the ceramic portion of the semiconductor package by a pair of upwardly standing legs with inwardly turned flanges where the flanges engage the marginal opposing portions of the top member. A heat dissipating member, having male-threaded base, is threadably inserted into the female-threaded bore to engage the upper surface of the silicon portion of the semiconductor package. The pressure of the heat dissipating member is independently adjustable, by hand, relative to the preset pressure of the top member onto the ceramic portion of the semiconductor package. As a result, the multiple pressure requirements of the semiconductor package can be accommodated in a single heat dissipating device without the need for tools.
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McCullough Kevin A.
Rife William B.
Chip Coolers, Inc.
Williams Alexander Oscar
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