Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2006-08-24
2009-11-24
Tran, Long K (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S675000, C257S720000, C257SE23051, C257SE23075, C257SE23087, C438S122000
Reexamination Certificate
active
07622803
ABSTRACT:
An assembly for supporting a substrate during vacuum processing operations includes a thermally conductive heat sink tray including at least one wafer pocket recessed therein, and a thermally conductive heat sink carrier in the at least one wafer pocket. The heat sink carrier includes a first surface in contact with a surface within the at least one wafer pocket and a second surface opposite the first surface. A heat sink is affixed to the second surface of the heat sink carrier.
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Cronin Daniel
Emerson David
Mieczowski Van
Parker Winston T.
Wood Jim
Cree Inc.
Myers Bigel & Sibley & Sajovec
Tran Long K
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