Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1999-02-24
2000-07-25
Williams, Alexander O.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257719, 257722, 257712, 257726, 257727, 174 163, 361704, 361697, 438117, H05K 720, H01L 2340, H01L 2336, F28F 700
Patent
active
060939613
ABSTRACT:
An molded heat sink assembly includes an integrally molded attachment clip for securing the assembly to a semiconductor package to be cooled. The assembly removes heat from a semiconductor device package having opposing side wall edges. The heat sink assembly also includes a heat conductive base member having a substantially flat bottom surface adapted to be positioned in flush thermal communication with a heat generating semiconductor device package. A number of heat dissipating elements are connected to and extend upwardly from the thermally conductive base member. A pair of semiconductor package engaging clips downwardly depend from and are integrally connected to opposing sides of the heat conductive base member. The engaging clips are disposed in gripping communication with respective opposing side wall edges of the semiconductor device package.
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Chip Coolers, Inc.
Williams Alexander O.
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