LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Flip-chip semiconductor device and method of forming the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Flip-chip semiconductor device having an improved reliability

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Flip-chip semiconductor device having I/O modules in an...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Flip-chip semiconductor device utilizing an elongated tip bump

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Flip-chip semiconductor device with enhanced reliability and man

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Flip-chip semiconductor device with improved power pad...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant

Flip-chip semiconductor devices having two encapsulants

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Flip-chip semiconductor devise having an electrode pad covered w

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Flip-chip semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Flip-chip semiconductor package structure and process for...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead

Flip-chip semiconductor package with lead frame and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Flip-chip semiconductor package with lead frame as chip...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Flip-chip sub-assembly, methods of making same and device...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Flip-chip system and method of making same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Flip-chip transition interface structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Flip-chip transition interface structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Flip-chip type connection with elastic contacts

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Flip-chip type nitride semiconductor light emitting diode

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Flip-chip type quad flat package and leadframe