Flip-chip semiconductor package with lead frame as chip...

Details Flip-chip semiconductor package with lead frame as chip... Flip-chip semiconductor package with lead frame as chip...

2007-09-25

2007-09-25

Whitehead, Jr., Carl (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With bumps on ends of lead fingers to connect to semiconductor

C257S779000, C257SE23031

Reexamination Certificate

active

10196305

ABSTRACT:
A flip-ship semiconductor package with a lead frame as a chip carrier is provided, wherein a plurality of leads of the lead frame are each formed with at least a dam member thereon. When a chip is mounted on the lead frame by means of solder bumps, each of the solder bumps is attached to the corresponding one of the leads at a position between the dam member and an inner end of the lead. During a reflow-soldering process for wetting the solder bumps to the leads, the dam members would help control collapse height of the solder bumps, so as to enhance resistance of the solder bumps to thermal stress generated by CTE (coefficient of thermal expansion) mismatch between the chip and the leads, thereby preventing incomplete electrical connection between the chip and the leads.

REFERENCES:
patent: 5331235 (1994-07-01), Chun
patent: 5714405 (1998-02-01), Tsubosaki et al.
patent: 5926694 (1999-07-01), Chigawa et al.
patent: 5989474 (1999-11-01), Suzuki
patent: 6131795 (2000-10-01), Sato
patent: 6184573 (2001-02-01), Pu
patent: 2002/0182773 (2002-12-01), Su et al.
C. Harper, editor, Electronic Packaging and Interconnection Handbook, third edition, McGraw-Hill, 2000.

Affiliated with

Also associated with

Rating

Flip-chip semiconductor package with lead frame as chip... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flip-chip semiconductor package with lead frame as chip..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flip-chip semiconductor package with lead frame as chip... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3721462