Flip-chip semiconductor device utilizing an elongated tip bump

Details Flip-chip semiconductor device utilizing an elongated tip bump Flip-chip semiconductor device utilizing an elongated tip bump

2005-12-13

2005-12-13

Chambliss, Alonzo (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S779000, C257S783000, C228S180220, C438S108000

Reexamination Certificate

active

06975036

ABSTRACT:
A flip-chip type semiconductor device includes a semiconductor chip having electrode pads formed and arranged on a chip surface thereof. Sprout-shaped metal bumps are bonded to the electrode pads on the chip, and an adhesive resin layer is formed on the chip surface of the chip such that tip ends of the sprout-shaped metal bumps are protruded from the adhesive resin layer. A circumference of the tip end of each sprout-shaped metal bump is surrounded by a protective resin material integrally swelled from the adhesive rein layer such that a tip end face of each sprout-shaped metal bump is at least exposed to the outside.

REFERENCES:
patent: 5371328 (1994-12-01), Gutierrez et al.
patent: 6271107 (2001-08-01), Massingill et al.
patent: 6590293 (2003-07-01), Onishi et al.
patent: 6780668 (2004-08-01), Tsukahara et al.
patent: 06-177214 (1994-06-01), None
patent: 09-97815 (1997-04-01), None
patent: 09172021 (1997-06-01), None
patent: 09-237806 (1997-09-01), None
patent: 10-079362 (1998-03-01), None
patent: 11-274241 (1999-10-01), None
patent: 11-297750 (1999-10-01), None
patent: 2000227952 (2000-08-01), None
patent: 2000-286302 (2000-10-01), None
patent: 2001-127395 (2001-05-01), None
patent: 2001-237274 (2001-08-01), None
patent: 2001-308140 (2001-11-01), None
patent: 2002-016022 (2002-01-01), None
patent: 2002-033343 (2002-01-01), None

Affiliated with

Also associated with

Rating

Flip-chip semiconductor device utilizing an elongated tip bump does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Flip-chip semiconductor device utilizing an elongated tip bump, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Flip-chip semiconductor device utilizing an elongated tip bump will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3516085