Flip-chip type quad flat package and leadframe

Details Flip-chip type quad flat package and leadframe Flip-chip type quad flat package and leadframe

2006-06-27

2006-06-27

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With bumps on ends of lead fingers to connect to semiconductor

C257S778000, C257S666000, C257S734000, C257S737000

Reexamination Certificate

active

07067904

ABSTRACT:
A flip-chip type quad flat package and a leadframe. The leadframe comprises a bump-connecting area and a non-connecting area. The maximum width of the bump-connecting area is larger than the width of the non-connecting area. A bump is limited to the bump-connecting area after performing a reflow process so that the bumps are prevented from collapsing, the manufacturing cost is reduced and the process is simplified.

REFERENCES:
patent: 6661087 (2003-12-01), Wu
patent: 6917098 (2005-07-01), Yamunan

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