Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2007-08-21
2007-08-21
Doan, Theresa (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S099000
Reexamination Certificate
active
11150288
ABSTRACT:
Disclosed herein is a flip-chip type nitride semiconductor light emitting diode. The light emitting diode comprises an n-type nitride semiconductor layer formed on a transparent substrate and having a substantially rectangular upper surface, an n-side electrode which comprises at least one bonding pad adjacent to at least one corner of the upper surface of the n-type nitride semiconductor layer, extended electrodes formed in a band from the bonding pad along four sides of the upper surface of the n-type nitride semiconductor layer and one or more fingers extended in a diagonal direction of the upper surface from the bonding pad and/or the extended electrodes, an active layer and a p-type nitride semiconductor layer sequentially stacked on a region of the n-type nitride semiconductor layer where the n-side electrode is not formed, and a highly reflective ohmic contact layer formed on the p-type nitride semiconductor layer.
REFERENCES:
patent: 6307218 (2001-10-01), Steigerwald et al.
patent: 6445007 (2002-09-01), Wu et al.
Back Hyung Ky
Kim Yong Chun
Kong Moon Heon
Lee Jae Hoon
Doan Theresa
Samsung Electro-Mechanics Co. Ltd.
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