Flip-chip semiconductor devices having two encapsulants

Details Flip-chip semiconductor devices having two encapsulants Flip-chip semiconductor devices having two encapsulants

1995-08-07

1997-05-13

Jackson, Jr., Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

257711, 257737, 257738, 257772, 257778, 257779, 257780, 257788, 257790, H01L 2312, H01L 2348, H01L 2328, H01L 2329

Patent

active

056295669

ABSTRACT:
A semiconductor device includes a semiconductor chip which is connected to a circuit substrate via solder bumps by flip-chip connection, a first encapsulant having a large Young's modulus and filling a space between the semiconductor chip and the circuit substrate in the central portion of the semiconductor chip, and a second encapsulant having a small Young's modulus and filling a space between the semiconductor chip and the circuit substrate in the peripheral portion of the semiconductor chip. A method for manufacturing the semiconductor device includes flowing the second encapsulant into position, but not the first encapsulant.

REFERENCES:
patent: 3401126 (1968-09-01), Miller
patent: 3429040 (1969-02-01), Miller
patent: 5315155 (1994-05-01), O'Donnelly et al.
patent: 5343076 (1994-08-01), Katayama et al.
"Microelectronics Packaging Handbook", Van Nostrand Reinhold, p. 389 (1989) .

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