Flip-chip type connection with elastic contacts

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

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Details

257688, 257737, 257777, H01L 2348, H01L 2352, H01L 2940, H01L 2310

Patent

active

059988754

ABSTRACT:
A mounting structure for a self-aligned flip-chip with elastic contacts. The mounting structure provides non-permanent joints combined with auto-aligning structures, and offers a symmetrical elastic alignment ensuring continued centering of the parts. This is done by using a flip-chip structure 200, which is based on a substrate 202 with an elastomer bump structure 204, molded by using anisotropically etched silicon as a mold. The pattern of elastic bumps 204 on the substrate correspond to a pad pattern 210 on a flip-chip 214. The bumps 204 can be coated with gold, and serve both as electrical contacts 206 and for vertical positioning. A guiding frame 212 of an elastomeric material with inclined frame walls 220 is provided around the bumps and is the same shape as the inclined walls 222 of the flip-chip 214.

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