Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent
1999-05-24
2000-11-28
Picardat, Kevin M.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
257734, 257774, H01L 2144, H01L 2148, H01L 2150
Patent
active
061539392
ABSTRACT:
A flip-chip semiconductor device and a method for under filling the flip-chip semiconductor device are disclosed. The flip-chip semiconductor device is provided with a substrate and a die having a plurality of solder bumps for connecting to the substrate. Encapsulation material is under filled between the die and the substrate. The substrate has a non-mask area defied in a center portion thereof while the remaining surface area is covered by a solder mask. The non-mask area defines a hole in the center thereof so that the encapsulation material can be dispensed along all sides of the die to flow toward the non-mask area and stop when reaching the non-mask area whereby the encapsulation material does not block the hole and air between said die and the substrate is limited in a void formed around the hole and communicated with the atmosphere via the hole.
REFERENCES:
patent: 5767575 (1998-06-01), Lan et al.
patent: 5920126 (1999-07-01), Sohara
Fang Jen-Kuang
Tao Su
Wang Hsueh-Te
Wang Wei-Chung
Advanced Semiconductor Engineering Inc.
Collins D. M.
Pelton William E.
Picardat Kevin M.
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