LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

COPPER WIRING STRUCTURE COMPRISING A COPPER MATERIAL BURIED...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Copper wiring with high temperature superconductor (HTS) layer

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Copper-alloy interconnection layer

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Copper-aluminum metallization

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

Copper-compatible fuse target

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Copper-containing C4 ball-limiting metallurgy stack for...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Copper-containing C4 ball-limiting metallurgy stack for...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Copper-containing plug for connection of semiconductor surface w

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Core cell structure and corresponding process for NAND-type high

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond

Core metal soldering knob flip-chip technology

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

Coreless package substrate with conductive structures

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Coreless substrate and manufacturing thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Corner bonding to lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal

Corner compensation method for fabricating MEMS and...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means

Corner protected shallow trench isolation device

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Corner protection to reduce wrap around

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure

Corona based charge voltage measurement

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure

Corona based charge voltage measurement

Active solid-state devices (e.g. – transistors – solid-state diode – Thin active physical layer which is – Heterojunction

Correlation tunnel device