LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array copper balancing

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array electronic package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Ball grid array having reduced mechanical stress

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Ball grid array housing having a cooling foil

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Ball grid array housing having a cooling foil

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Ball grid array IC package and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip

Ball grid array integrated circuit package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Ball grid array integrated circuit package which employs a flip

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ball grid array integrated circuit package with palladium...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough

Ball grid array integrated circuit package with thermal conducto

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding – With means to shield device contained in housing or package...

Ball grid array module

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Ball grid array module

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond

Ball grid array module and method of manufacturing same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough

Ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond

Ball grid array package