Ball grid array module

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

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Details

257728, H01L 23498, H01L 2348

Patent

active

059557893

ABSTRACT:
A Plastic Ball Grid Array electronic package of the Cavity Down type for use in HF application. A Faraday Cage is realized to protect the active element from external HF wave interferences. The lateral sides of the Faraday Cage are constituted by a row of solder balls connected in a zig-zag way to plated through holes along the four edges of the substrate. The top side of the Cage is the metal stiffener of the Cavity Down package electrically connected to the through holes, while the bottom side is represented by the ground plane of the main board properly connected to the solder balls.

REFERENCES:
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5583378 (1996-12-01), Marrs et al.
patent: 5717245 (1998-02-01), Pedder
patent: 5796170 (1998-08-01), Marcantonio

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