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Semiconductor package having multiple dies with...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Semiconductor package having multiple row of leads

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
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Semiconductor package having plural chips side by side...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
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Semiconductor package having reduced thickness

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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Semiconductor package having reduced thickness

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
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Semiconductor package having reduced thickness

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
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Semiconductor package having solder joint of improved...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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Semiconductor package having stacked dice and leadframes and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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Semiconductor package having support film formed on inner leads

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Semiconductor package including chip housing, encapsulation and

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Patent

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Semiconductor package including flex circuit, interconnects...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
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Semiconductor package including flex circuit, interconnects...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
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Semiconductor package including flip chip

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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Semiconductor package including flip chip

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Semiconductor package including isolated ring structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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Semiconductor package including organo-metallic coating...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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Semiconductor package including ring structure connected to...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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Semiconductor package insulation film and manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
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Semiconductor package leadframe assembly and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
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Semiconductor package produced by solder plating without...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
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