Semiconductor package having support film formed on inner leads

Details Semiconductor package having support film formed on inner leads Semiconductor package having support film formed on inner leads

1996-06-05

1997-04-15

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257673, 257669, 257676, 257688, 257735, H01L 2350, H01L 2328, H01L 2348, H01L 2302

Patent

active

056212429

ABSTRACT:
A thin semiconductor package having a support film formed on an upper surface of the inner leads with a thickness approximately equal to the thickness of a portion of the molding compound overlaying the inner leads.

REFERENCES:
patent: 5018005 (1991-05-01), Lin et al.
patent: 5173766 (1992-12-01), Long et al.
patent: 5300808 (1994-04-01), Suppelsa et al.
patent: 5334858 (1994-08-01), Wada
patent: 5359222 (1994-10-01), Okutomo et al.
patent: 5375041 (1994-12-01), McMahon
patent: 5388029 (1995-02-01), Moriyama
patent: 5477080 (1995-12-01), Ishisaka et al.
patent: 5536969 (1996-07-01), Matsuoka
Dr. Subash Khadpe, "An Overview of Thin Packages", Semiconductor Pakcaging Update, 1992 no month.

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