Semiconductor package having multiple row of leads

Details Semiconductor package having multiple row of leads Semiconductor package having multiple row of leads

2007-02-06

2007-02-06

Chambliss, Alonzo (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

C257S670000, C257S690000, C257S773000, C257SE23031, C257SE23043, C361S813000

Reexamination Certificate

active

11103938

ABSTRACT:
Provided is a method of producing a semiconductor package including at least two rows of leads in which the leads of each row separately connecting a semiconductor chip to an external substrate. The method includes: forming a lead frame, the lead frame including a die pad and a plurality of leads arranged about the die pad; attaching an adhesive tape to a surface of the lead frame covering at least substantially the die pad and the plurality of leads; removing portions of the leads and the adhesive tape disposed in a dividing region and thereby separating at least some of the plurality of leads to form multiple rows of leads; and mounting a semiconductor chip on the die pad, electrically connecting the semiconductor chip with the lead frame, and molding the lead frame and the semiconductor chip to provide a semiconductor package. The adhesive tape attached at undesirable locations of the lead frame is preferably removed after provision of the semiconductor package.

REFERENCES:
patent: 6229200 (2001-05-01), Mclellan et al.
patent: 6489218 (2002-12-01), Kim et al.
patent: 6720207 (2004-04-01), Minamio et al.
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patent: 7109572 (2006-09-01), Fee et al.
patent: 2002/0153596 (2002-10-01), Tsubosaki et al.
patent: 2003078094 (2003-03-01), None

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