Semiconductor package including chip housing, encapsulation and

Details Semiconductor package including chip housing, encapsulation and Semiconductor package including chip housing, encapsulation and

1997-05-23

2000-09-05

Monin, Jr., Donald L.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

257712, 257778, H01L 2312

Patent

active

061147559

ABSTRACT:
A semiconductor package provided with a reinforcing plate on the side of the lead joined face of which a chip housing concave portion is formed, a semiconductor chip housed and fixed in the chip housing concave portion of this reinforcing plate, a plurality of leads joined and held on the lead joined face of the reinforcing plate, the inner lead section of which is joined to the semiconductor chip via a bump and in the outer lead section of which a protruded electrode is formed, a solder resist film formed on the lead except the bump formed area and the electrode formed area of this lead and a polyimide film formed on the side of the inner lead section of the lead on the solder resist film and the manufacturing method are disclosed and hereby, the quality of the semiconductor package with ultra-multipin structure is stabilized.

REFERENCES:
patent: 4209355 (1980-06-01), Burns
patent: 5481798 (1996-01-01), Ohsawa et al.
patent: 5583378 (1996-12-01), Marrs et al.
patent: 5602059 (1997-02-01), Horiuchi
patent: 5663106 (1997-09-01), Karavakis et al.
patent: 5720099 (1998-02-01), Parker et al.
patent: 5728599 (1998-03-01), Rostoker
patent: 5756377 (1998-05-01), Ohsawa
patent: 5760465 (1996-02-01), Alcoe et al.
patent: 5945741 (1999-08-01), Ohsawa et al.

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