LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

COF package and tape substrate used in same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

COF tape carrier, semiconductor element, COF semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

COF-use tape carrier and COF-structured semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Coil transducer isolator packages

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

COL (Chip-On-Lead) multi-chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

COL-TSOP with nonconductive material for reducing package...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Collar positionable about a periphery of a contact pad and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Comb insert for semiconductor packaged devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Compact flash memory card with clamshell leadframe

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

Compact power semiconductor package and method with stacked...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Compensating lead structure for distributed IC components

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Compliant microelectronic assemblies

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Compliant semiconductor package with anisotropic conductive...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Compliant terminal mountings with vented spaces and methods

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Compliant wirebond pedestal

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Component arrangement comprising a carrier

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Component for connecting a semiconductor chip to a substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Components with releasable leads and methods of making...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Composite bump tape automated bonded structure