Comb insert for semiconductor packaged devices

Details Comb insert for semiconductor packaged devices Comb insert for semiconductor packaged devices

1991-01-23

1993-04-27

Wojciechowicz, Edward J.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257736, 257776, 257787, H01L 2348

Patent

active

052065367

ABSTRACT:
A comb insert for semiconductor packaged devices is disclosed. The comb is conductive and thus useful to function as a power supply bus in transferring power to the semiconductor die. A base, formed out of a conductive material, resides underneath the lead fingers of the semiconductor packaged device, electrically isolated from the lead fingers. The base has teeth extending from it, also formed out of the conductive material, that reside between the lead fingers of the semiconductor packaged device. Some of the teeth are electrically connected to the lead fingers for receiving external power. Some of the teeth are electrically connected to the bonding pads of the semiconductor die. Power is transferred from the lead fingers for receiving it, through the teeth electrically connected to these lead fingers, through the base, through the teeth electrically connected to the bonding pads, and to the semiconductor die. Utilizing the comb insert in a lead on chip lead frame semiconductor packaged device solves the problem of wire bond shorting to the power supply bus portions of the lead frame.

REFERENCES:
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4916519 (1990-04-01), Ward
patent: 5025114 (1991-06-01), Braden

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