Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent
1997-11-20
1999-01-19
Chaudhuri, Olik
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
257738, 257783, H01L 23495
Patent
active
058616616
ABSTRACT:
This invention provides a bonded structure and a method of forming the bonded structure for joining a lead array to the conducting bonding pads of an integrated circuit element. The invention uses an anisotropic conductive film with tape automated bonding to form the bonded structure. The invention also uses integrated circuit elements having composite bumps as input/output pads. The composite bumps comprise a polymer body covered by a conductive metal coating. The invention provides a low cost method of tape automated bonding which uses lower temperature and pressure in the bonding process and provides a bond which is automatically encapsulated after the bonding has been completed. The lower temperature and pressure improve the dimensional stability of the elements of the bonded structure and the automatic encapsulation provides improved reliability.
REFERENCES:
patent: 4731282 (1988-03-01), Tsukagashi et al.
patent: 4740657 (1988-04-01), Tsukagashi et al.
patent: 4811081 (1989-03-01), Lyden
patent: 4963002 (1990-10-01), Tagusa et al.
patent: 5001542 (1991-03-01), Tsukagoshi et al.
patent: 5136365 (1992-08-01), Pennisi et al.
patent: 5604379 (1997-02-01), Mori
patent: 5641996 (1997-06-01), Omoya et al.
patent: 5705852 (1998-01-01), Orihara et al.
patent: 5726491 (1998-03-01), Tajima et al.
Chang Shyh-Ming
Fang Su-Yu
Lee Yu-Chi
Tang Pao-Yun
Ackerman Stephen B.
Chaudhuri Olik
Industrial Technology Research Institute
Kelley Nathan K.
Prescott Larry J.
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