Coil transducer isolator packages

Details Coil transducer isolator packages Coil transducer isolator packages

2011-05-24

2011-05-24

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S676000, C257SE23043, C257SE23052

Reexamination Certificate

active

07948067

ABSTRACT:
In an embodiment, the invention provides a coil transducer isolator package comprising at least one lead frame, at least two integrated circuits (ICs) and a flex circuit comprising at least a first coil transducer. The first coil transducer comprises at least one metal coil. The coil transducer isolator package is fabricated such that no portion of the lead frame is physically located within a spatial volume extending substantially perpendicular to the at least one metal coil. The boundaries of the spatial volume are defined by a periphery of the at least one metal coil. At least one of the two ICs is at least partially located within the spatial volume extending substantially perpendicular to the at least one metal coil.

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