Component arrangement comprising a carrier

Details Component arrangement comprising a carrier Component arrangement comprising a carrier

2011-03-22

2011-03-22

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With stress relief

C257S666000, C257SE23038

Reexamination Certificate

active

07911039

ABSTRACT:
A component arrangement comprising a carrier, a component in a housing with electrical contacts and a moulding compound that encloses the carrier, the semiconductor component in the housing and the electrical contacts, wherein the component is applied on the carrier, and wherein the carrier is provided with holes, and a method for producing a component arrangement, wherein the carrier is provided with holes, the component is positioned on the carrier, the component is connected to the carrier, the component with the carrier is positioned in the leadframe, and this arrangement is enclosed by a moulding compound.

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P. Carrère et al., New Encapsulation Technique Using Standar DBC Substrates Technology, May 1998, pp. 2103-2107, IEEE Xplore, Print ISBN: 0-7803-4489-8.

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