Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate
2008-03-20
2011-11-15
Arora, Ajay K (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
C257S692000, C257SE23055, C438S123000
Reexamination Certificate
active
08058713
ABSTRACT:
A COF package having a tape substrate including external input terminals and external output terminals provided in a chip non-mounting area, input wirings connected to the external input terminals respectively, output wirings connected to the external output terminals respectively, internal input wirings which are provided from the chip non-mounting area to a chip mounting area and provided between the input wirings and which are connected to the external input terminals, respectively, and a dummy wiring provided from the chip non-mounting area to the chip mounting area and provided between the internal input wirings; and a semiconductor chip including input electrodes connected to the input wirings respectively, output electrodes connected to the output wirings respectively, internal input electrodes connected to the internal input wirings respectively, and a dummy electrode provided spaced from each input electrode along one side of the chip surface, and connected to the dummy wiring.
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Arora Ajay K
Oki Semiconductor Co., Ltd.
Volentine & Whitt PLLC
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