COF package and tape substrate used in same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S692000, C257SE23055, C438S123000

Reexamination Certificate

active

08058713

ABSTRACT:
A COF package having a tape substrate including external input terminals and external output terminals provided in a chip non-mounting area, input wirings connected to the external input terminals respectively, output wirings connected to the external output terminals respectively, internal input wirings which are provided from the chip non-mounting area to a chip mounting area and provided between the input wirings and which are connected to the external input terminals, respectively, and a dummy wiring provided from the chip non-mounting area to the chip mounting area and provided between the internal input wirings; and a semiconductor chip including input electrodes connected to the input wirings respectively, output electrodes connected to the output wirings respectively, internal input electrodes connected to the internal input wirings respectively, and a dummy electrode provided spaced from each input electrode along one side of the chip surface, and connected to the dummy wiring.

REFERENCES:
patent: 6867490 (2005-03-01), Toyosawa
patent: 7379307 (2008-05-01), Imamura et al.
patent: 2002/0109814 (2002-08-01), Murahashi et al.
patent: 2004/0070057 (2004-04-01), Yoshiike et al.
patent: 2008/0043195 (2008-02-01), Shiki
patent: 9260579 (1997-10-01), None
patent: 2002124537 (2002-04-01), None
patent: 2002244580 (2002-08-01), None
patent: 2004127974 (2004-04-01), None
patent: 200680167 (2006-03-01), None
patent: 2006080167 (2006-03-01), None
patent: 200781058 (2007-03-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

COF package and tape substrate used in same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with COF package and tape substrate used in same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and COF package and tape substrate used in same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4278385

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.