Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate
2003-06-03
2004-10-26
Potter, Roy (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
C257S701000, C257S680000
Reexamination Certificate
active
06809406
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a COF (Chip-on-Film) semiconductor device and a method for manufacturing such a semiconductor device.
2. Description of the Related Art
A COF semiconductor device is a device in which a semiconductor chip is bonded to a COF tape carrier. The semiconductor chip is positioned in alignment with an opening in a resist formed on the COF tape carrier and the gap between the COF tape carrier and the semiconductor chip is filled with a resin material for sealing.
In order to control the flow of a sealing resin material, conventional COF semiconductor devices are generally designed with the following features.
(1) Dummy patterns are formed on the COF tape carrier as disclosed in Japanese Patent Publications (KOKAI) No. 08-335593 and No. 2002-124526; and
(2) Bumps for a semiconductor chip are formed in special shapes as disclosed in Japanese Patent Publication (KOKAI) No. 2001-35165.
However, with the aforementioned conventional COF semiconductor devices, the sealing material ejected around the sides of a semiconductor chip spreads along the sides more rapidly than the sealing material that spreads into a gap between the COF tape carrier and the semiconductor chip during the sealing process. Thus, the air can be trapped between the semiconductor chip and an opening of the resist formed on the tape base material. The resin material also spreads into gaps between bumps provided on the electrodes of the semiconductor chip, thereby trapping the air in the gaps between the bumps. The air trapped in the gaps between the semiconductor chip and the tape base results in air bubbles, leading to cracks in sealed portions and corrosion of sealed portions.
For COF semiconductor devices disclosed in the aforementioned references, the dummy patterns and/or bumps do not appear to have been arranged in an attempt to prevent air bubbles from occurring. Thus, the need exists for optimizing the arrangement or orientation of dummy patterns and/or bumps, thereby eliminating the possibility of air bubbles occurring.
SUMMARY OF THE INVENTION
The present invention was made in view of the problems of the aforementioned conventional art.
An object of the present invention is to provide an optimum structure of a COF semiconductor device that prevents the occurrence of air bubbles and a method for manufacturing such a COF semiconductor device.
A COF tape carrier includes a resist formed on the COF tape carrier. The resist has portions that define a resist opening within the resist so that a semiconductor element is mounted on the COF tape carrier in alignment with the resist opening. The COF tape carrier also includes ridges and valleys formed within the resist opening, the ridges and valleys extending in directions oblique to a perimeter of the resist opening.
A COF tape carrier includes a resist, ridges and valleys, and an inner lead. The resist is formed on the COF tape carrier. The resist has portions that define a resist opening within the resist so that a semiconductor element is mounted on the COF tape carrier in alignment with the resist opening. The ridges and valleys are formed within the resist opening. The ridges and valleys extend in directions oblique to a perimeter of the resist opening. The inner lead is formed in the resist opening and has a first portion that extends in a direction oblique to the perimeter.
A semiconductor element is mountable on a COF tape carrier. The semiconductor element includes a surface, and ridges and valleys. The surface has perimeters that define the surface. The ridges and valleys are formed on the surface, each of the ridges and valleys extending in directions oblique to the perimeters.
A semiconductor element is mountable on a COF tape carrier. The semiconductor element includes a first surface and a line of bumps. The first surface has perimeters and electrode pads formed thereon. Each of the bumps is formed on the electrode pads and has a second surface that opposes an adjacent bump and extends in a plane oblique to the sides.
A method of manufacturing a COF taper carrier type semiconductor apparatus includes the steps of:
positioning a plurality of needles each of which ejects a sealing resin between a COF tape carrier and a semiconductor element; and
moving the plurality of needles along different paths simultaneously while the plurality of needles ejects the sealing resin.
Further scope of applicability of the present invention will become apparent from the detailed description given hereinafter. However, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the invention, are given by way of illustration only, since various changes and modifications within the spirit and scope of the invention will become apparent to those skilled in the art from this detailed description.
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Yamanaka Shuichi
Yoshiike Kazuaki
Oki Electric Industry Co. Ltd.
Potter Roy
Volentine & Francos, PLLC
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