Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2009-08-18
2010-12-07
Lee, Calvin (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C438S123000, C438S615000
Reexamination Certificate
active
07847378
ABSTRACT:
A wire bonder (900) with a rigid pedestal (902) having resilient inserts (920). A package (904) placed on the pedestal (902) contains an electrical device (906). The bond pads on the electrical device (906) are electrically connected to bond pads on the package (904) by a series of bond wires (908) through use of a well know bonding process. A vacuum source holds the package (904) against the pedestal (902) deforming the resilient strips (920) located in the rigid member (902) of the pedestal and ensuring good contact between the ground pads of the package (904) and conductive resilient members (920). The resilient members (920) are conductive and electrically connect the package grounds to a system ground (922).
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Hamilton David L.
Marsh Jeffrey W.
White R. Tracy
Brady III Wade James
Brill Charles A.
Lee Calvin
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
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