Compact power semiconductor package and method with stacked...

Details Compact power semiconductor package and method with stacked... Compact power semiconductor package and method with stacked...

2011-01-11

2011-01-11

Blum, David S (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With bumps on ends of lead fingers to connect to semiconductor

C438S123000, C336S200000, C257SE21510, C257SE23054

Reexamination Certificate

active

07868431

ABSTRACT:
A power semiconductor package is disclosed with high inductance rating while exhibiting a reduced foot print. It has a bonded stack of power IC die at bottom, a power inductor at top and a circuit substrate, made of leadframe or printed circuit board, in the middle. The power inductor has a inductor core of closed magnetic loop. The circuit substrate has a first number of bottom half-coil forming conductive elements beneath the inductor core. A second number of top half-coil forming conductive elements, made of bond wires, three dimensionally formed interconnection plates or upper leadframe leads, are located atop the inductor core with both ends of each element connected to respective bottom half-coil forming conductive elements to jointly form an inductive coil enclosing the inductor core. A top encapsulant protectively encases the inductor core, the top half-coil forming conductive elements, the bottom half-coil forming conductive elements and the circuit substrate.

REFERENCES:
patent: 3614554 (1971-10-01), Shield et al.
patent: 3858138 (1974-12-01), Gittleman et al.
patent: 4103267 (1978-07-01), Olschewski
patent: 4543553 (1985-09-01), Mandai et al.
patent: 5032815 (1991-07-01), Kobayashi et al.
patent: 5041903 (1991-08-01), Millerick et al.
patent: 5070317 (1991-12-01), Bhagat
patent: 5425166 (1995-06-01), Hastings et al.
patent: 5428245 (1995-06-01), Lin et al.
patent: 5469334 (1995-11-01), Balakrishnan
patent: 5886393 (1999-03-01), Merrill et al.
patent: 5959846 (1999-09-01), Noguchi et al.
patent: 6236538 (2001-05-01), Yamada et al.
patent: 6429764 (2002-08-01), Karam et al.
patent: 6608367 (2003-08-01), Gibson et al.
patent: 6621140 (2003-09-01), Gibson et al.
patent: 6630881 (2003-10-01), Takeuchi et al.
patent: 6765284 (2004-07-01), Gibson et al.
patent: 6847104 (2005-01-01), Huang et al.
patent: 6927481 (2005-08-01), Gibson et al.
patent: 6930584 (2005-08-01), Edo et al.
patent: 6998952 (2006-02-01), Zhou et al.
patent: 7046114 (2006-05-01), Sakata
patent: 7091576 (2006-08-01), Yamamoto et al.
patent: 7167073 (2007-01-01), Hatano
patent: 7196514 (2007-03-01), Li
patent: 7229908 (2007-06-01), Drizlikh et al.
patent: 7268659 (2007-09-01), Nishio et al.
patent: 7368908 (2008-05-01), Yamada
patent: 7622796 (2009-11-01), Shi et al.
patent: 7786837 (2010-08-01), Hebert
patent: 2002/0097128 (2002-07-01), Imam
patent: 2003/0070282 (2003-04-01), Hiatt et al.
patent: 2004/0169266 (2004-09-01), Maxwell
patent: 2004/0212475 (2004-10-01), Schumacher
patent: 2006/0227518 (2006-10-01), Nishio et al.
patent: 2007/0026676 (2007-02-01), Li et al.
patent: 2008/0061918 (2008-03-01), Greiff
patent: 2008/0094165 (2008-04-01), Orlando et al.
patent: 2008/0238599 (2008-10-01), Hebert et al.
patent: 2009/0057822 (2009-03-01), Wen et al.
patent: 2010/0007456 (2010-01-01), Joehren et al.
patent: 05198440 (1993-08-01), None
USPTO Office Action for U.S. Appl. No. 12/011,489, mailing date Mar. 19, 2010.
USPTO Office Action for U.S. Appl. No. 12/011,489, mailing date Aug. 19, 2010.
USPTO Office Action for U.S. Appl. No. 12/379,473 mailing date Sep. 15, 2010.

Affiliated with

Also associated with

Rating

Compact power semiconductor package and method with stacked... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Compact power semiconductor package and method with stacked..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Compact power semiconductor package and method with stacked... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2670321