Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent
1995-06-05
1997-10-28
Brown, Peter Toby
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
257669, 257700, 361769, 361772, 361776, H01L 2348
Patent
active
056820615
ABSTRACT:
A semiconductor chip assembly is mounted to contact pads in a compact area array. An interposer is disposed between the chip and the substrate. The contacts on the chip are connected to terminals on the interposer by flexible leads extending through apertures in the interposer. The terminals on the interposer in turn are bonded to the contact pads on the substrate. Flexibility of the leads permits relative movement of the contacts on the chip relative to the terminals and the contact pads of the substrate and hence relieves the stresses caused by differential thermal expansion. The arrangement provides a compact structure similar to that achieved through flip-chip bonding, but with markedly increased resistance to thermal cycling damage.
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DiStefano Thomas H.
Khandros Igor Y.
Brown Peter Toby
Tessera Inc.
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