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Leadframe having delamination resistant die pad

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Leadframe having die attach pad with delamination and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Leadframe having exposed, solderable outer lead ends

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Leadframe having metal impregnated silicon carbide mounting area

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Leadframe having one or more power/ground planes without vias

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Leadframe having resilient carrier positioning means

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Leadframe having slots in a die pad

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Reexamination Certificate

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Leadframe IC packages having top and bottom integrated heat...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Leadframe including bendable support arms for downsetting a die

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent

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Leadframe including die paddle apertures for reducing...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Leadframe inductors

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Leadframe inductors

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Leadframe of a conductive material and component with a...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Leadframe of a leadless flip-chip package and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Leadframe of quad flat non-leaded package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Reexamination Certificate

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Leadframe on heat sink (LOHS) semiconductor packages and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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Leadframe package for MEMS microphone assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Leadframe package for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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Leadframe package for semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Leadframe semiconductor integrated circuit device using the same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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