Leadframe of a conductive material and component with a...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

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C257S676000, C257S696000, C257S698000, C257S674000, C257S671000, C257S672000, C257S673000

Reexamination Certificate

active

06946721

ABSTRACT:
A leadframe of a conductive material includes a central region to accommodate a chip and a plurality of connecting fingers extending at least from one side in the direction of the central region, a contact region being provided adjacent to the central region on at least some of the connecting fingers. The course of the connecting fingers is such that a sectional face in an arbitrary imaginary cross-section at right angles to the main face of the leadframe has leadframe material. In such a case, it is attempted to keep cross-sections in a component without leadframe material as small as possible.

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