Leadframe package for MEMS microphone assembly

Details Leadframe package for MEMS microphone assembly Leadframe package for MEMS microphone assembly

2007-01-03

2009-06-23

Richards, N Drew (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S666000, C257SE23145, C438S123000

Reexamination Certificate

active

07550828

ABSTRACT:
A cavity semiconductor package has a pre-molded leadframe construction. The leadframe is formed by molding around a die pad, and plural terminal lands. The leadframe has a hole for an acoustic port, such that the package can be soldered on a back side of a printed circuit board and have air access to a sensor die in the package from a front side of the printed circuit board via the acoustic port. The leadframe may also have a hollow or concave recess that defines an acoustic cavity in conjunction with the sensor die or printed circuit board.

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