Leadframe semiconductor integrated circuit device using the same

Details Leadframe semiconductor integrated circuit device using the same Leadframe semiconductor integrated circuit device using the same

1994-09-22

1997-06-10

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257672, 257674, 257676, 257783, H01L 23495, H01L 2348

Patent

active

056379137

ABSTRACT:
In order to improve the package body cracking resistance of an LSI package at the reflow soldering and to provide both a leadframe suitable for fabricating the LSI package according to the flexible manufacturing system and an LSI using the leadframe, the adhered area between a semiconductor chip 2 and a resin is enlarged by making the external size of a die pad 3 smaller than that of the semiconductor chip to be mounted thereon. Moreover, a variety of semiconductor chips 2 having different external sizes can be mounted on the die pad 3 by cutting the leading ends of leads 5 to a suitable length in accordance with the external sizes of the semiconductor chips 2.

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"Electronic Packaging and Interconnection Handbook", pp. 7.25-7.27 (7.7.2.), C. Harper.
"Webster's II New Riverside Unversity Dictionary", pp. 772-773.

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