Leadframe including bendable support arms for downsetting a die

Details Leadframe including bendable support arms for downsetting a die Leadframe including bendable support arms for downsetting a die

1997-03-18

1998-08-04

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257669, 257666, H01L 23495

Patent

active

057898065

ABSTRACT:
A leadframe including bendable support arms for downsetting a die attach pad and method are disclosed herein. The leadframe includes at least one frame member and the die attach pad. At least two distinct, readily bendable support arms are connected with and extend between the die attach pad and the frame member. The support arms are configured to be bent in a predetermined way in the method of the invention such that when they are bent they provide previously unattainable amounts of die attach pad downset within the overall configuration of the leadframe.

REFERENCES:
patent: 5394751 (1995-03-01), Ishibashi

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