Leadframe including die paddle apertures for reducing...

Details Leadframe including die paddle apertures for reducing... Leadframe including die paddle apertures for reducing...

2011-07-12

2011-07-12

Warren, Matthew E (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S678000, C257SE23050, C257SE23141

Reexamination Certificate

active

07977773

ABSTRACT:
Embodiments of the present invention provide leadframes including a die paddle including one or more apertures defined therein, and electronic packages employing the same and having a microelectronic device mounted on the die paddle over one or more of the apertures. Other embodiments may be described and claimed.

REFERENCES:
patent: 5021864 (1991-06-01), Kelly et al.
patent: 6075282 (2000-06-01), Champagne
patent: 6870254 (2005-03-01), Estacio et al.
patent: 2002/0149091 (2002-10-01), Palmteer et al.
patent: 2005/0199986 (2005-09-01), Ma et al.
patent: 2005/0242417 (2005-11-01), Youn et al.
patent: 2005/0255438 (2005-11-01), Manos

Affiliated with

Also associated with

Rating

Leadframe including die paddle apertures for reducing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Leadframe including die paddle apertures for reducing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Leadframe including die paddle apertures for reducing... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2685875