Tab semiconductor device having die edge protection and method f

Details Tab semiconductor device having die edge protection and method f Tab semiconductor device having die edge protection and method f

1995-08-11

1996-12-10

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

257684, 257687, 257787, H01L 23495, H01L 2306

Patent

active

055833705

ABSTRACT:
A semiconductor device (42) has a protective containment housing (44) around the edges (24) of the die (12) to protect the die. A plurality of leads (30) are TAB bonded to the die's active surface (18). The containment housing is attached around the die such that a portion of the inner sidewalls of the housing contacts the edges of the die to seal the edges. The top edge of the containment housing acts as a dam to prevent encapsulant (14') overflowing down the die edges and to the die's inactive surface (28). Various embodiments of the containment housing are possible.

REFERENCES:
patent: 4143456 (1979-03-01), Inoue
patent: 4330790 (1982-05-01), Burns
patent: 4711688 (1987-12-01), Pienimaa
patent: 4839713 (1989-06-01), Teraoka et al.
patent: 4907061 (1990-03-01), Kohara
patent: 5073817 (1991-12-01), Ueda

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