Tape automated bonding(tab)semiconductor device and method for m

Details Tape automated bonding(tab)semiconductor device and method for m Tape automated bonding(tab)semiconductor device and method for m

1991-08-16

1994-02-22

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With stress relief

257674, 257692, H01L 2348, H01L 2944, H01L 2952

Patent

active

052890325

ABSTRACT:
Deformation of TAB tapes due to temperature changes is prevented by thermo-mechanical leads. In one embodiment of the invention, a semiconductor device (30) includes an electronic component (31) and a TAB tape. The tape includes a carrier film (12) and electrical leads (20) formed on the carrier film. The electrical leads are electrically coupled to the electronic component. Also included on the carrier film are thermo-mechanical leads (32) which are formed in opposing regions of the carrier film, regions which are typically void of leads. The thermo-mechanical leads have approximately the same lead pitch as the electrical leads in order to provide a uniform distribution of stresses across the TAB tape upon exposure to varying temperatures.

REFERENCES:
patent: 4859614 (1989-08-01), Sugahara et al.
patent: 4865193 (1989-09-01), Shimamoto
patent: 5053852 (1991-10-01), Biswas et al.
Research Disclosure, "Stress Relief for Tape Automated Bonding" Oct. 1988 No. 24, Kenneth Mason Publ. Ltd.

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