TAB tape semiconductor device

Details TAB tape semiconductor device TAB tape semiconductor device

1998-04-24

2000-06-27

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257 48, 257723, H01L 23495, H01L 2358, H01L 2334

Patent

active

060810246

ABSTRACT:
A TAB tape semiconductor device includes a unit resin tape, a plurality of test pads, wiring patterns, and a plurality of semiconductor chips. The unit resin tape has a plurality of device holes. The plurality of test pads are formed on the unit resin tape. The wiring patterns are formed to extend radially from the device holes. The plurality of semiconductor chips are mounted in the plurality of device holes and connected to distal end portions of the wiring patterns through pads. The semiconductor chips are connected to each other through some of the wiring patterns.

REFERENCES:
patent: 4977441 (1990-12-01), Ohtani et al.
patent: 5517036 (1996-05-01), Semba et al.

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