Tape application platform and processes therefor

Details Tape application platform and processes therefor Tape application platform and processes therefor

1998-08-24

2000-03-28

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257676, 257677, 257666, H01L 23495

Patent

active

060435577

ABSTRACT:
A platform carries an integrated circuit (IC) (20) for handling and alignment through wire bonding operations, provides interconnections, and supports the shielded IC with uniform, controlled adhesive thickness. The platform base (10) has a flat portion which may have a slot (30) extending the length of a chip with wire-bond pads (140). The IC is mounted to the platform base with cast or contained adhesive, epoxy, or tape (50), which provides at least one adhesive surface. For several rows of wire-bond pads, there may be several slots. If the platform carries more than one chip, the platform base may have one or more slots (30, 40) per chip. A platform may carry other components (110, 120). Circuitry (90) may be printed on one or both sides of the platform base, with moderate resistivity to damp ringing of noise signals. Wire bonds are made through the slot (30), connecting IC pads with circuitry. The platform base may have conductive areas (90) on one or both sides to provide a shield or bus connected by wire bonds. Conductive bus elements (60 and 70) may be attached with tape (80). The platform may have terminals (100) for interconnection with higher level of circuitry and/or narrow leads (1220) extending over the IC. The platform base may be formed of metal, stamped in a continuous strip consisting of many individual platform segments, the individual segments being excised during assembly.

REFERENCES:
patent: 3908075 (1975-09-01), Jackson et al.
patent: 4410905 (1983-10-01), Grabbe
patent: 4539472 (1985-09-01), Poetker et al.
patent: 4595945 (1986-06-01), Graver
patent: 4598308 (1986-07-01), James et al.
patent: 4616413 (1986-10-01), Iliou et al.
patent: 4754319 (1988-06-01), Saito et al.
patent: 4796078 (1989-01-01), Phelps, Jr. et al.
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4937203 (1990-06-01), Eichelberger et al.
patent: 4965654 (1990-10-01), Karner et al.
patent: 4996587 (1991-02-01), Hinrichsmeyer et al.
patent: 5070390 (1991-12-01), Shimizu
patent: 5075252 (1991-12-01), Schendelman
patent: 5099309 (1992-03-01), Kryzaniwsky
patent: 5140404 (1992-08-01), Fogal et al.
patent: 5153708 (1992-10-01), Ohikata et al.
patent: 5170328 (1992-12-01), Kruppa
patent: 5177032 (1993-01-01), Fogal et al.
patent: 5218229 (1993-06-01), Farnworth
patent: 5220195 (1993-06-01), McShane et al.
patent: 5227232 (1993-07-01), Lim
patent: 5227338 (1993-07-01), Kryzaniwsky
patent: 5227662 (1993-07-01), Ohno et al.
patent: 5237201 (1993-08-01), Tanaki et al.
patent: 5250839 (1993-10-01), Katoh et al.
patent: 5349234 (1994-09-01), DesJardin et al.
patent: 5350947 (1994-09-01), Takegawa et al.
patent: 5382830 (1995-01-01), Akyurek et al.
patent: 5399903 (1995-03-01), Rostoker et al.
patent: 5412247 (1995-05-01), Martin
patent: 5428247 (1995-06-01), Sohn et al.
patent: 5889320 (1999-03-01), Phelps, Jr. et al.
Carden et al. "Stabilized Long Wire Bonding Technique" IBM Technical Disclosure Bulletin (1989).
Dombroski et al. "Thin Small Outline Packages" IBM Technical Disclosure Bulletin vol. 34, No. 1 (Jun. 1991) pp. 358-359.
Hoffman et al. "Automated Chip, Decal, and Lead Frame Lamination Method" IBM Techncsl Disclosure Bulletin vol. 31, No. 2 (Jul. 1988) pp. 405-406.
Lumbra et al. "Multiple Chip Heat Sink Package" IBM Technical Disclosure Bulletin vol. 29 No. 6 (Nov. 1986) pp. 2584-2585.

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