Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent
1998-05-20
2000-02-15
Williams, Alexander Oscar
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
257669, 257700, 257782, 257783, 257674, H01L 2348, H01L 2316, H05K 114
Patent
active
060256419
ABSTRACT:
Improved TAB tapes include an electrically insulating tape, an electrically conductive pattern on a first surface of the electrically insulating tape and a protective layer for protecting exposed portions the electrically conductive pattern. The protective layer may comprise a solder resist layer. A bonding agent is also provided for bonding the electrically conductive pattern to the electrically insulating tape. According to a preferred aspect of the present invention, any "peel-off" stress which may arise during formation of the TAB tape and/or during subsequent thermal treatment steps and cause cambering of the electrically insulating tape, may be reduced by forming a camber suppressing film on a second surface of the electrically insulating tape. The camber suppressing film is preferably made of the same material as the protective layer so that any camber stress induced by the protective layer is offset equally by an opposing camber stress induced by the camber suppressing film. Thus, TAB tapes having less susceptibility to parasitic cambering can be formed. The camber suppressing film may also be made of a material which has a thermal expansion coefficient in a range between about 0.9 and 1.1 times the thermal expansion coefficient of the protective layer.
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Samsung Electronics Co,. Ltd.
Williams Alexander Oscar
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