Tape automated bonding (TAB) semiconductor device with ground pl

Details Tape automated bonding (TAB) semiconductor device with ground pl Tape automated bonding (TAB) semiconductor device with ground pl

1992-02-14

1993-06-22

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257691, 257668, H01L 2350

Patent

active

052218589

ABSTRACT:
A TAB semiconductor device (10) has a ground plane which is electrically coupled to ground leads without traditional conductive vias. Instead of using vias, a ground plane (34) has a plurality of ground leads (36) embossed on a surface of the ground plane in a first TAB leadframe (14), thereby forming one monolithic ground plane assembly. The ground leads are shaped to form inner lead portions (46) and outer lead portions (48) which are bonded to a semiconductor die (38) and a substrate (not illustrated), respectively. A second TAB leadframe (12) forms signal leads (16). The two leadframes are superimposed with each other to form a composite, multilayered TAB leadframe structure. Improved electrical and physical continuity between the ground leads and the ground plane help to lower lead inductance.

REFERENCES:
patent: 4496965 (1985-01-01), Orcutt et al.
patent: 4711700 (1987-12-01), Cusak
patent: 4899185 (1990-02-01), Newman
patent: 4912547 (1990-03-01), Bilowith et al.
patent: 5028983 (1991-07-01), Bickford et al.
patent: 5036380 (1991-07-01), Chase
patent: 5053921 (1991-10-01), Nelson et al.
patent: 5089878 (1992-02-01), Lee
patent: 5099306 (1992-03-01), Dunaway et al.
patent: 5142351 (1992-08-01), Matta

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