Tape automated bonding (TAB) semiconductor device with ground pl

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

257691, 257668, H01L 2350

Patent

active

052218589

ABSTRACT:
A TAB semiconductor device (10) has a ground plane which is electrically coupled to ground leads without traditional conductive vias. Instead of using vias, a ground plane (34) has a plurality of ground leads (36) embossed on a surface of the ground plane in a first TAB leadframe (14), thereby forming one monolithic ground plane assembly. The ground leads are shaped to form inner lead portions (46) and outer lead portions (48) which are bonded to a semiconductor die (38) and a substrate (not illustrated), respectively. A second TAB leadframe (12) forms signal leads (16). The two leadframes are superimposed with each other to form a composite, multilayered TAB leadframe structure. Improved electrical and physical continuity between the ground leads and the ground plane help to lower lead inductance.

REFERENCES:
patent: 4496965 (1985-01-01), Orcutt et al.
patent: 4711700 (1987-12-01), Cusak
patent: 4899185 (1990-02-01), Newman
patent: 4912547 (1990-03-01), Bilowith et al.
patent: 5028983 (1991-07-01), Bickford et al.
patent: 5036380 (1991-07-01), Chase
patent: 5053921 (1991-10-01), Nelson et al.
patent: 5089878 (1992-02-01), Lee
patent: 5099306 (1992-03-01), Dunaway et al.
patent: 5142351 (1992-08-01), Matta

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Tape automated bonding (TAB) semiconductor device with ground pl does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Tape automated bonding (TAB) semiconductor device with ground pl, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tape automated bonding (TAB) semiconductor device with ground pl will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1443106

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.