Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent
1996-01-11
1998-06-16
Arroyo, Teresa M.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
257692, 257690, 257664, 257728, H01L 23495, H01L 2348, H01L 2352, H01L 2334
Patent
active
057675694
ABSTRACT:
The method for mounting a semiconductor chip comprises disposing conductive thermoplastic polyimide as a bonding material between an inner lead of the TAB tape and an external connecting electrode of the semiconductor chip, applying pressure to the conductive thermoplastic polyimide by a wedge with heating by a hot stage via the semiconductor chip. The semiconductor chip comprises the external connecting electrode adhered the conductive thermoplastic polyimide. The method for fabricating the semiconductor chip comprises forming a signal line and a protective film, forming an electrode pad on the signal line not provided the protective film, forming a conductive thermoplastic polyimide layer on the semiconductor wafer by spin coating, forming a resist on the conductive thermoplastic polyimide layer and performing an etching with using the resist as a mask. The inner lead of the TAB tape is made of conductive thermoplastic polyimide, not gilded. The flip-chip mounting substrate comprises a semiconductor chip connecting electrode comprising a signal line made of conductive thermoplastic polyimide, a protective film protecting the signal line, and adhering conductive thermoplastic polyimide on the signal line not providing the protective film. The microwave device comprises mounting the semiconductor chip in the inner lead of the TAB tape by adhering the external connecting electrode of the semiconductor chip to the inner lead of the TAB tape. Therefore, it is not required using high cost material for mounting the semiconductor chip, so that reducing in cost is accomplished.
REFERENCES:
patent: 5206712 (1993-04-01), Kornrumpf et al.
patent: 5338975 (1994-08-01), Cole, Jr. et al.
patent: 5399902 (1995-03-01), Bickford et al.
patent: 5428247 (1995-06-01), Sohn et al.
patent: 5488257 (1996-01-01), Bhattacharyya et al.
Goto Kei
Inoue Akira
Matubayashi Hiroto
Nakajima Yasuharu
Notani Yoshihiro
Arroyo Teresa M.
Mitsubishi Denki & Kabushiki Kaisha
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