Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent
1998-11-25
2000-09-05
Hardy, David
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
257673, 257778, H01L 23498
Patent
active
061147540
ABSTRACT:
An area TAB film has a plurality of first lead lines and a plurality of second lead lines on a base film. Each of first lead lines will be electrically connected to each of peripheral electrode pads while each of second lead lines will be electrically connected to each of inner electrode pads when the chip will be mounted on the TAB film. In this TAB film, the first and the second lead lines have a staggered arrangement from each other and are extended in opposite directions. Practically, the distance or the gap between the first lead lines is wider than that of conventional TAB film. Consequently, the TAB film can cope with an increase of the number of pads with a package size kept unchanged and serves to obtain a low cost package as compared with the conventional TAB film.
REFERENCES:
patent: 5168368 (1992-12-01), Gow, 3rd et al.
patent: 5293066 (1994-03-01), Tsumura
patent: 5473190 (1995-12-01), Inoue et al.
Hardy David
NEC Corporation
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