TAB package connecting host device element

Details TAB package connecting host device element TAB package connecting host device element

2011-03-08

2011-03-08

Arora, Ajay K (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

C257S692000, C257SE23034, C257SE23055, C438S123000

Reexamination Certificate

active

07902647

ABSTRACT:
A device is provided in which a glass panel having beveled edge is flexibly connected to a TAB package. The outer lead portions of the TAB package include an end portion of first width connected to a connection pattern on the glass panel, a terminal portion having a second width greater than the first width, and a transition portion having a width that varies between the first and second widths. When the TAB package is connected the transition portion of the respective outer lead portions are disposed over the beveled edge of the glass panel.

REFERENCES:
patent: 4680613 (1987-07-01), Daniels et al.
patent: 5920115 (1999-07-01), Kimura et al.
patent: 6084291 (2000-07-01), Fujimori
patent: 6310299 (2001-10-01), Kim
patent: 6555755 (2003-04-01), Yanagisawa
patent: 6841737 (2005-01-01), Komatsubara et al.
patent: 2002/0079124 (2002-06-01), Moden

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