Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent
1996-07-31
1998-09-01
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
257665, 257692, H01L 23495
Patent
active
058014349
ABSTRACT:
There is provided a tape automated bonding (TAB) tape including, a first film having a first open space therewithin, a second film having a second open space therewithin, the first film being located in the second open space, a third film located in the first open space of the first film, a first closed-loop wiring formed on the second film, a second closed-loop wiring formed on the third film, at least one signal wiring formed on the first film, and at least one ground wiring formed on the first film, the ground wiring inwardly and outwardly extending from the first film to connect the first and second closed-loop wirings to each other. The TAB tape makes it possible to increase the number of the ground wirings by providing the closed-loop wirings. As a result, it is possible to reduce effective inductance and ground bounce noises of the ground wirings, and further possible to reduce mutual capacities among the signal wirings with the result of reduced cross-talk noises.
REFERENCES:
patent: 4801999 (1989-01-01), Hayward et al.
patent: 5473190 (1995-12-01), Inoue et al.
NEC Corporation
Potter Roy
Thomas Tom
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