TAB type semiconductor device and method of manufacturing the sa

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

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Details

257668, 257670, H01L 2348

Patent

active

052372014

ABSTRACT:
This invention provides a TAB type semiconductor device in which a plurality of lead pattern regions are formed on a film-like tape formed of an insulating resin, and LSI chips are inner lead-bonded onto the corresponding lead pattern regions. A linear reference potential supply wiring pattern is formed on one edge portion in the widthwise direction of a formation surface of the lead pattern regions on the tape to extend in the tape extending direction. The wiring pattern is electrically connected to a reference potential supply lead (14A) of each lead pattern region.

REFERENCES:
patent: 4132856 (1979-01-01), Hutchison et al.
patent: 4949155 (1990-08-01), Tajima et al.
patent: 4977441 (1990-12-01), Ohtani et al.
patent: 5001544 (1991-03-01), Boucard
patent: 5036379 (1991-07-01), Smith et al.
patent: 5036380 (1991-07-01), Chase
patent: 5049974 (1991-09-01), Nelson et al.
"Testable TAB tape with inner guard ring", IBM TDB, vol. 31, No. 4, Sep./88, pp. 30-31.

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