LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Lead frame

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Structure for manufacturing a semiconductor die with copper...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

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Structure for mounting semiconductor device, method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor

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Structure for mounting semiconductor part in which bump and...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

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Structure of a lead-frame matrix of photoelectron devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

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Structure of a lead-frame matrix of photoelectron devices

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

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Structure of a pin platform for integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

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Structure of disturbing plate having down set

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

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Substrate assembly for stressed systems

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

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Substrate based unmolded package including lead frame...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

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Substrate for accepting wire bonded or flip-chip components

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

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Substrate for holding a chip of semi-conductor package, semi-con

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

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Substrate for holding a chip of semi-conductor package,...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

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Substrate for mounting semiconductor chip with parallel...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

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Substrate for use in semiconductor manufacturing and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

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Substrate having a plurality of I/O routing arrangements for...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

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Substrate structure capable of reducing package singular stress

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

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Substrate with dam bar structure for smooth flow of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

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Substrate with slot

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant

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Substrate-based IC package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

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Substrates for semiconductor devices with shielding for NC...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Reexamination Certificate

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