Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2006-03-20
2008-11-25
Dang, Trung (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S738000, C257SE23021
Reexamination Certificate
active
07456493
ABSTRACT:
There is provided a structure for mounting a semiconductor part having improved productivity, in which a bump is detached from a land portion and a method of manufacturing a mounting substrate used therein. The structure for mounting the semiconductor part includes a mounting substrate1having an insulating substrate2on which a wiring pattern3and a land portion4are provided, a semiconductor part5mounted on the mounting substrate1using a bump7and the land portion4, and an underfill8inserted between the semiconductor part5and the insulating substrate2. An undercut portion4chaving an inverse tapered shape from the insulating substrate2to an upper surface of the land portion4is provided in an edge4aof the land portion4in which the bump7is located, and the bump is inserted into the undercut portion. Accordingly, since the couple between the bump7and the land portion4becomes stronger, the bump is not detached from the land portion4when the underfill8expands or contracts.
REFERENCES:
patent: 6400019 (2002-06-01), Hirashima et al.
patent: 6472608 (2002-10-01), Nakayama
patent: 2002/0048847 (2002-04-01), Tsunoi et al.
patent: 2005/0208749 (2005-09-01), Beckman et al.
patent: 11-40940 (1999-02-01), None
Murata Shinji
Takeuhi Masayoshi
Alps Electric Co. ,Ltd.
Beyer Law Group LLP
Dang Trung
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