Radio frequency over-molded leadframe package
Radio frequency over-molded leadframe package
Re-routing lead frame package and semiconductor memory package u
Reduced capacitance lead frame for lead on chip package
Reduced copper lead frame for saw-singulated chip package
Reduced inductance IC leaded package
Reduced size semiconductor package with stacked dies
Reduced stress LOC assembly
Reduction of chip carrier flexing during thermal cycling
Redundant pinout configuration for signal enhancement in IC...
Redundant pinout configuration for signal enhancement in IC...
Reframed chip-on-tape die
Reinforced die pad support structure
Reinforced lead-frame assembly for interconnecting circuits...
Reinforced leadframe to substrate attachment
Reinforced thin lead frames and leads
Reliable metal leads in high speed LSI semiconductors using dumm
Resin encapsulated semiconductor device and method for manufactu
Resin encapsulated semiconductor device and the production...
Resin encapsulation semiconductor device utilizing grooved...