Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2005-08-09
2005-08-09
Wilczewski, Mary (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C257S676000, C257S678000, C257S734000, C257S777000
Reexamination Certificate
active
06927478
ABSTRACT:
A semiconductor package comprising a plurality of leads. Each of the leads defines opposed first and second surfaces, and a third surface which is also disposed in opposed relation to the second surface. The first surface is oriented between the second and third surfaces. The semiconductor package further comprises first and second semiconductor dies which each define opposed first and second surfaces. Disposed on the first surface of the first semiconductor die are a plurality of bond pads, with bond pads also being disposed on the second surface of the semiconductor die. The first surface of the first semiconductor die is attached to the second surface of each of the leads, with the first surface of the second semiconductor die being attached to the second surface of the first semiconductor die. A plurality of conductive connectors or wires electrically connect the bond pads of the first and second semiconductor dies to respective ones of the leads. An encapsulating portion is applied to and at least partially encapsulates the leads, the first and second semiconductor dies, and the conductive connectors.
REFERENCES:
patent: 3838984 (1974-10-01), Crane et al.
patent: 4054238 (1977-10-01), Lloyd et al.
patent: 4530152 (1985-07-01), Roche et al.
patent: 4707724 (1987-11-01), Suzuki et al.
patent: 4756080 (1988-07-01), Thorp, Jr. et al.
patent: 4812896 (1989-03-01), Rothgery et al.
patent: 5041902 (1991-08-01), McShane
patent: 5157480 (1992-10-01), McShane et al.
patent: 5172213 (1992-12-01), Zimmerman
patent: 5172214 (1992-12-01), Casto
patent: 5200362 (1993-04-01), Lin et al.
patent: 5200809 (1993-04-01), Kwon
patent: 5214845 (1993-06-01), King et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5221642 (1993-06-01), Burns
patent: 5258094 (1993-11-01), Furui et al.
patent: 5273938 (1993-12-01), Lin et al.
patent: 5277972 (1994-01-01), Sakumoto et al.
patent: 5278446 (1994-01-01), Nagaraj et al.
patent: 5279029 (1994-01-01), Burns
patent: 5332864 (1994-07-01), Liang et al.
patent: 5336931 (1994-08-01), Juskey et al.
patent: 5343076 (1994-08-01), Katayama et al.
patent: 5406124 (1995-04-01), Morita et al.
patent: 5424576 (1995-06-01), Djennas et al.
patent: 5435057 (1995-07-01), Bindra et al.
patent: 5474958 (1995-12-01), Djennas et al.
patent: 5521429 (1996-05-01), Aono et al.
patent: 5534467 (1996-07-01), Rostoker
patent: 5604376 (1997-02-01), Hamburgen et al.
patent: 5608267 (1997-03-01), Mahulikar et al.
patent: 5639990 (1997-06-01), Nishihara et al.
patent: 5640047 (1997-06-01), Nakashima
patent: 5641997 (1997-06-01), Ohta et al.
patent: 5646831 (1997-07-01), Manteghi
patent: 5650663 (1997-07-01), Parthasaranthi
patent: 5683806 (1997-11-01), Sakumoto et al.
patent: 5689135 (1997-11-01), Ball
patent: 5696666 (1997-12-01), Miles et al.
patent: 5701034 (1997-12-01), Marrs
patent: 5710064 (1998-01-01), Song et al.
patent: 5736432 (1998-04-01), Mackessy
patent: 5776798 (1998-07-01), Quan et al.
patent: 5783861 (1998-07-01), Son
patent: 5814881 (1998-09-01), Alagaratnam et al.
patent: 5814883 (1998-09-01), Sawai et al.
patent: 5821615 (1998-10-01), Lee
patent: 5835988 (1998-11-01), Ishii
patent: 5859471 (1999-01-01), Kuraishi et al.
patent: 5866939 (1999-02-01), Shin et al.
patent: 5877043 (1999-03-01), Alcoe et al.
patent: 5894108 (1999-04-01), Mostafazadeh et al.
patent: 5903049 (1999-05-01), Mori
patent: 5977613 (1999-11-01), Takata et al.
patent: 5977630 (1999-11-01), Woodworth et al.
patent: 5981314 (1999-11-01), Glenn et al.
patent: 5986885 (1999-11-01), Wyland
patent: 6001671 (1999-12-01), Fjelstad
patent: 6025640 (2000-02-01), Yagi et al.
patent: 6031279 (2000-02-01), Lenz
patent: RE36613 (2000-03-01), Ball
patent: 6072228 (2000-06-01), Hinkle et al.
patent: 6087715 (2000-07-01), Sawada et al.
patent: 6087722 (2000-07-01), Lee et al.
patent: 6100594 (2000-08-01), Fukui et al.
patent: 6118184 (2000-09-01), Ishio et al.
patent: 6130115 (2000-10-01), Okumura et al.
patent: 6130473 (2000-10-01), Mostafazadeh et al.
patent: 6140154 (2000-10-01), Hinkle et al.
patent: 6143981 (2000-11-01), Glenn
patent: 6181002 (2001-01-01), Juso et al.
patent: 6198171 (2001-03-01), Huang et al.
patent: 6225146 (2001-05-01), Yamaguchi et al.
patent: 6229200 (2001-05-01), Mclellan et al.
patent: 6242281 (2001-06-01), Mclellan et al.
patent: 6281568 (2001-08-01), Glenn et al.
patent: 6294100 (2001-09-01), Fan et al.
patent: 6303984 (2001-10-01), Corsis
patent: 6316838 (2001-11-01), Ozawa et al.
patent: 6384472 (2002-05-01), Huang
patent: 6410979 (2002-06-01), Abe
patent: 6452279 (2002-09-01), Shimoda
patent: 6559525 (2003-05-01), Huang
patent: 2002/0011654 (2002-01-01), Kimura
patent: 19734794 (1997-08-01), None
patent: 0794572 (1997-10-01), None
patent: 5745959 (1982-03-01), None
patent: 59227143 (1984-12-01), None
patent: 60195957 (1985-10-01), None
patent: 6139555 (1986-02-01), None
patent: 61248541 (1986-11-01), None
patent: 629639 (1987-01-01), None
patent: 63205935 (1988-08-01), None
patent: 63233555 (1988-09-01), None
patent: 1106456 (1989-04-01), None
patent: 692076 (1994-04-01), None
patent: 7312405 (1995-11-01), None
patent: 8125066 (1996-05-01), None
patent: 8306853 (1996-11-01), None
patent: 98205 (1997-01-01), None
patent: 98206 (1997-01-01), None
patent: 98207 (1997-01-01), None
patent: 992775 (1997-04-01), None
patent: 941979 (1994-01-01), None
patent: 9772358 (1997-11-01), None
patent: 2002049944 (2000-12-01), None
patent: 19950018924 (2002-10-01), None
Amkor Technology Inc.
Lewis Monica
Stetina Brunda Garred & Brucker
Wilczewski Mary
LandOfFree
Reduced size semiconductor package with stacked dies does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Reduced size semiconductor package with stacked dies, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reduced size semiconductor package with stacked dies will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3458153